Semiconductor devices having an electro-static discharge protection structure

ABSTRACT

A semiconductor device includes a substrate and a metallization layer. The substrate has an active region that includes opposite first and second edges. The metallization layer is disposed above the substrate, and includes a pair of metal lines and a metal plate. The metal lines extend from an outer periphery of the active region into the active region and toward the second edge of the active region. The metal plate interconnects the metal lines and at least a portion of which is disposed at the outer periphery of the active region.

RELATED APPLICATION

This application is divisional application claiming priority to U.S.patent application Ser. No. 14/609,498 filed on Jan. 30, 2015, thecontents of which are hereby fully incorporated by reference.

BACKGROUND

A conventional semiconductor device includes a substrate, ametallization layer that is disposed above the substrate and thatincludes horizontal interconnects or vertical interconnects, and aplurality of components, e.g., active components, such as transistors,diodes, etc., and/or passive components, such as resistor, capacitors,and inductors, that are disposed between the substrate and themetallization layer and that are electrically connected by themetallization layer. When an electro-static discharge (ESD) surgeoccurs, the ESD surge may damage the components of the semiconductordevice. It is therefore desirable to provide protection for componentsof semiconductor devices against ESD surges.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1A is a schematic sectional top view of the first exemplarysemiconductor device in accordance with some embodiments.

FIG. 1B is a schematic sectional view taken along line 1B-1B of FIG. 1Ain accordance with some embodiments.

FIG. 2A is a schematic sectional top view of the second exemplarysemiconductor device in accordance with some embodiments.

FIG. 2B is a schematic sectional view taken along line 2B-2B of FIG. 2Ain accordance with some embodiments.

FIG. 3A is a schematic sectional top view of the third exemplarysemiconductor device in accordance with some embodiments.

FIG. 3B is a schematic sectional view taken along line 3B-3B of FIG. 3Ain accordance with some embodiments.

FIG. 4A is a schematic sectional top view of the fourth exemplarysemiconductor device in accordance with some embodiments.

FIG. 4B is a schematic sectional view taken along line 4B-4B of FIG. 4Ain accordance with some embodiments.

FIG. 5A is a schematic sectional top view of the fifth exemplarysemiconductor device in accordance with some embodiments.

FIG. 5B is a schematic sectional view taken along line 5B-5B of FIG. 5Ain accordance with some embodiments.

FIG. 6A is a schematic sectional top view of the sixth exemplarysemiconductor device in accordance with some embodiments.

FIG. 6B is a schematic sectional view taken along line 6B-6B of FIG. 6Ain accordance with some embodiments.

FIG. 7 is a schematic sectional side view of the seventh exemplarysemiconductor device in accordance with some embodiments.

FIG. 8 is a schematic sectional side view of the eighth exemplarysemiconductor device in accordance with some embodiments.

FIG. 9 is a flowchart illustrating an exemplary method of fabricating asemiconductor device in accordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “underneath,” “below,”“lower,” “above,” “on,” “top,” “bottom” and the like, may be used hereinfor ease of description to describe one element or feature'srelationship to another element(s) or feature(s) as illustrated in thefigures. The spatially relative terms are intended to encompassdifferent orientations of the structure in use or operation in additionto the orientation depicted in the figures. The apparatus may beotherwise oriented (rotated 90 degrees or at other orientations) and thespatially relative descriptors used herein may likewise be interpretedaccordingly.

It is observed that when an ESD surge is applied to a semiconductordevice the ESD surge causes a sudden rise in a temperature of thesemiconductor device. The present disclosure provides a semiconductordevice that includes a metallization layer, the structure of whichprovides protection for components of the semiconductor device from ESDsurges. In an exemplary embodiment, the metallization layer includes apair of metal lines, and a metal plate that interconnects the metallines. When an ESD surge occurs, current density of current flowingthrough the metal lines is distributed over the metal plate, therebyefficiently dissipating heat resulting from the ESD surge, whereby thecomponents of the semiconductor device are protected against the ESDsurge.

FIG. 1A is a schematic sectional top view of the first exemplarysemiconductor device in accordance with some embodiments and FIG. 1B isa schematic sectional view taken along line 1B-1B of FIG. 1A inaccordance with some embodiments. As illustrated in FIG. 1B, thesemiconductor device includes a substrate 110 and a plurality ofmetallization layers M5-M10.

The substrate 110 has an active region 160. In an exemplary embodiment,as best shown in FIG. 1A, the active region 160 is generallyrectangular, and includes a first edge 160 a, and a second edge 160 bopposite to the first edge 160 a in a direction transverse to alongitudinal direction thereof. Those skilled in the art will appreciateafter reading this disclosure that other shapes for the active regionare possible.

The metallization layers M5-M10 are disposed sequentially from bottom totop above the substrate 110. Since the constructions of themetallization layers M5-M10 are substantially the same, only themetallization layer M10 will be described hereinafter.

As best shown in FIG. 1A, the metallization layer M10 includes a pair offirst metal lines 120, a first metal plate 130, a pair of second metallines 140, and a second metal plate 150. The first metal lines 120 andthe second metal lines 140 are substantially parallel to each other andare arranged alternately along the length of the active region 160.

The first metal lines 120 extend from an outer periphery of the activeregion 160 into the active region 160 and toward the second edge 160 bof the active region 160. The first metal plate 130 cooperates with thefirst metal lines 120 to form a generally U-shaped cross section,interconnects sidewalls of the first metal lines 120, and is disposed atthe outer periphery of the active region 160. In this exemplaryembodiment as seen in the figure, the first metal plate 130 is integralwith the first metal lines 120.

The second metal lines 140 extend from the outer periphery of the activeregion 160 into the active region 160 and toward the first edge 160 a ofthe active region 160. The second metal plate 150 cooperates with thesecond metal lines 140 to form a generally U-shaped cross section,interconnects sidewalls of the second metal lines 140, and is disposedat the outer periphery of the active region 160. In this exemplaryembodiment, the second metal plate 150 is integral with the second metallines 140.

In this exemplary embodiment, as illustrated in FIG. 1B, the first metalplate 130 and the active region 160 define a distance D1 therebetween ofabout 0 μm to about 10 μm, the second metal plate 150 and the activeregion 160 define a distance D2 therebetween of about 0 μm to about 10μm, and the first and second metal lines 120, 140 and the first andsecond metal plates 130, 150 have substantially the same thickness T. Inanother exemplary embodiment (not shown), the first and second metalplates 130, 150 have a thickness different from that of the first andsecond metal lines 120, 140.

In this exemplary embodiment, as illustrated in FIG. 1A, the first andsecond metal lines 120, 140 have substantially the same length L1, L2and width W1, W2 and the first and second metal plates 130, 150 havesubstantially the same length L3, L4. In another exemplary embodiment,the first metal lines 120 have a length L1 different from a length L2 ofthe second metal lines 140. In another exemplary embodiment, the firstmetal lines 120 have a width W1 different from a width W2 of the secondmetal lines 140. In another exemplary embodiment, the first metal plate130 has a length L3 different from a length L4 of the second metal plate150.

FIG. 2A is a schematic sectional top view of the second exemplarysemiconductor device in accordance with some embodiments and FIG. 2B isa schematic sectional view taken along line 2B-2B of FIG. 2A inaccordance with some embodiments. As illustrated in FIG. 2B, thesemiconductor device includes a substrate 210 and a plurality ofmetallization layers M5-M10.

The substrate 210 has an active region 260. In an exemplary embodiment,as best shown in FIG. 2A, the active region 260 is generallyrectangular, and includes a first edge 260 a, and a second edge 260 bopposite to the first edge 260 a in a direction transverse to alongitudinal direction thereof.

The metallization layers M5-M10 are disposed sequentially from bottom totop above the substrate 210. Since the constructions of themetallization layers M5-M10 are substantially the same, only themetallization layer M10 will be described hereinafter.

As best shown in FIG. 2A, the metallization layer M10 includes a pair offirst metal lines 220, a first metal plate 230, a pair of second metallines 240, and a second metal plate 250. The first metal lines 220 andthe second metal lines 240 are substantially parallel to each other andare arranged alternately along the length of the active region 260.

The first metal lines 220 extend from an outer periphery of the activeregion 260 into the active region 260 and toward the second edge 260 bof the active region 260. The first metal plate 230 cooperates with thefirst metal lines 220 to form a generally U-shaped cross section,interconnects sidewalls of the first metal lines 220, and is disposed atthe outer periphery of the active region 260. In this exemplaryembodiment, the first metal plate 230 is integral with the first metallines 220.

The second metal lines 240 extend from the outer periphery of the activeregion 260 into the active region 260 and toward the first edge 260 a ofthe active region 260. The second metal plate 250 cooperates with thesecond metal lines 240 to form a generally U-shaped cross section,interconnects sidewalls of the second metal lines 240, and extends fromthe outer periphery of the active region 260 into the active region 260,e.g., to an inner periphery of the active region 260. In this exemplaryembodiment, the second metal plate 250 is integral with the second metallines 240.

In this exemplary embodiment, as illustrated in FIG. 2B, the first metalplate 230 and the active region 260 define a distance D therebetween ofabout 0 μm to about 10 μm and the first and second metal lines 220, 240and the first and second metal plates 230, 250 have substantially thesame thickness T. In another exemplary embodiment, the first and secondmetal plates 230, 250 have a thickness different from that of the firstand second metal lines 220, 240.

In this exemplary embodiment, as illustrated in FIG. 2A, the first metallines 220 have a length L1 shorter than a length L2 of the second metallines 240, the first and second metal lines 220, 240 have substantiallythe same width W1, W2, and the first metal plate 230 has a length L3shorter than a length L4 of the second metal plate 250. In anotherexemplary embodiment, the first and second metal lines 220, 240 havesubstantially the same length L1, L2. In another exemplary embodiment,the first metal lines 220 have a length L1 longer than a length L2 ofthe second metal lines 240. In another exemplary embodiment, the firstmetal lines 220 have a width W1 different from a width W2 of the secondmetal lines 240. In another exemplary embodiment, the first and secondmetal plates 230, 250 have substantially the same length L3, L4. Inanother exemplary embodiment, the first metal plate 230 has a length L3longer than a length L4 of the second metal plate 250.

FIG. 3A is a schematic sectional top view of the third exemplarysemiconductor device in accordance with some embodiments and FIG. 3B isa schematic sectional view taken along line 3B-3B of FIG. 3A inaccordance with some embodiments. As illustrated in FIG. 3B, thesemiconductor device includes a substrate 310 and a plurality ofmetallization layers M5-M10.

The substrate 310 has an active region 360. In an exemplary embodiment,as best shown in FIG. 3A, the active region 360 is generallyrectangular, and includes a first edge 360 a, and a second edge 360 bopposite to the first edge 360 a in a direction transverse to alongitudinal direction thereof.

The metallization layers M5-M10 are disposed sequentially from bottom totop above the substrate 310. Since the constructions of themetallization layers M5-M10 are substantially the same, only themetallization layer M10 will be described hereinafter.

As best shown in FIG. 3A, the metallization layer M10 includes a pair offirst metal lines 320, a first metal plate 330, a pair of second metallines 340, and a second metal plate 350. The first metal lines 320 andthe second metal lines 340 are substantially parallel to each other andare arranged alternately along the length of the active region 360.

The first metal lines 320 extend from an outer periphery of the activeregion 360 into the active region 360 and toward the second edge 360 bof the active region 360. The first metal plate 330 cooperates with thefirst metal lines 320 to form a generally U-shaped cross section,interconnects sidewalls of the first metal lines 320, and is disposed atthe outer periphery of the active region 360. In this exemplaryembodiment, the first metal plate 330 is integral with the first metallines 320.

The second metal lines 340 extend from an inner periphery of the activeregion 360 toward the first edge 360 a of the active region 360. Thesecond metal plate 350 cooperates with the second metal lines 340 toform a generally U-shaped cross section, interconnects sidewalls of thesecond metal lines 340, and is disposed at the inner periphery of theactive region 360. In this exemplary embodiment, the second metal plate350 is integral with the second metal lines 340.

In this exemplary embodiment, as illustrated in FIG. 3B, the first metalplate 330 and the active region 360 define a distance D therebetween ofabout 0 μm to about 10 μm and the first and second metal lines 320, 340and the first and second metal plates 330, 350 have substantially thesame thickness T. In another exemplary embodiment, the first and secondmetal plates 330, 350 have a thickness different from that of the firstand second metal lines 320, 340.

In this exemplary embodiment, as illustrated in FIG. 3A, the first andsecond metal lines 320, 340 have substantially the same length L1, L2and width W1, W2 and the first and second metal plates 330, 350 havesubstantially the same length L3, L4. In another exemplary embodiment,the first metal lines 320 have a length L1 different from a length L2 ofthe second metal lines 340. In another exemplary embodiment, the firstmetal lines 320 have a width W1 different from a width W2 of the secondmetal lines 340. In another exemplary embodiment, the first metal plate330 has a length L3 different from a length L4 of the second metal plate350.

FIG. 4A is a schematic sectional top view of the fourth exemplarysemiconductor device in accordance with some embodiments and FIG. 4B isa schematic sectional view taken along line 4B-4B of FIG. 4A inaccordance with some embodiments. As illustrated in FIG. 4B, thesemiconductor device includes a substrate 410 and a plurality ofmetallization layers M5-M10.

The substrate 410 has an active region 460. In an exemplary embodiment,as best shown in FIG. 4A, the active region 460 is generallyrectangular, and includes a first edge 460 a, and a second edge 460 bopposite to the first edge 460 a in a direction transverse to alongitudinal direction thereof.

The metallization layers M5-M10 are disposed sequentially from bottom totop above the substrate 410. Since the constructions of themetallization layers M5-M10 are substantially the same, only themetallization layer M10 will be described hereinafter.

As best shown in FIG. 4A, the metallization layer M10 includes a pair offirst metal lines 420, a first metal plate 430, a pair of second metallines 440, and a second metal plate 450. The first metal lines 420 andthe second metal lines 440 are substantially parallel to each other andare arranged alternately along the length of the active region 460.

The first metal lines 420 extend from an outer periphery of the activeregion 460 into the active region 460 and toward the second edge 460 bof the active region 460. The first metal plate 430 cooperates with thefirst metal lines 420 to form a generally U-shaped cross section,interconnects sidewalls of the first metal lines 420, and extends fromthe outer periphery of the active region 460 into the active region 460,e.g., to an inner periphery of the active region 460. In this exemplaryembodiment, the first metal plate 430 is integral with the first metallines 420.

The second metal lines 440 extend from the outer periphery of the activeregion 460 into the active region 460 and toward the first edge 460 a ofthe active region 460. The second metal plate 450 cooperates with thesecond metal lines 440 to form a generally U-shaped cross section,interconnects sidewalls of the second metal lines 440, and extends fromthe outer periphery of the active region 460 into the active region 460,e.g., to the inner periphery of the active region 460. In this exemplaryembodiment, the second metal plate 450 is integral with the second metallines 440.

In this exemplary embodiment, as illustrated in FIG. 4B, the first andsecond metal lines 420, 440 and the first and second metal plates 430,450 have substantially the same thickness T. In another exemplaryembodiment, the first and second metal plates 430, 450 have a thicknessdifferent from that of the first and second metal lines 420, 440.

In this exemplary embodiment, as illustrated in FIG. 4A, the first andsecond metal lines 420, 440 have substantially the same length L1, L2and width W1, W2 and the first and second metal plates 430, 450 havesubstantially the same length L3, L4. In another exemplary embodiment,the first metal lines 420 have a length L1 different from a length L2 ofthe second metal lines 440. In another exemplary embodiment, the firstmetal lines 420 have a width W1 different from a width W2 of the secondmetal lines 440. In another exemplary embodiment, the first metal plate430 has a length L3 different from a length L4 of the second metal plate450.

FIG. 5A is a schematic sectional top view of the fifth exemplarysemiconductor device in accordance with some embodiments and FIG. 5B isa schematic sectional view taken along line 5B-5B of FIG. 5A inaccordance with some embodiments. As illustrated in FIG. 5B, thesemiconductor device includes a substrate 510 and a plurality ofmetallization layers M5-M10.

The substrate 510 has an active region 560. In an exemplary embodiment,as best shown in FIG. 5A, the active region 560 is generallyrectangular, and includes a first edge 560 a, and a second edge 560 bopposite to the first edge 560 a in a direction transverse to alongitudinal direction thereof.

The metallization layers M5-M10 are disposed sequentially from bottom totop above the substrate 510. Since the constructions of themetallization layers M5-M10 are substantially the same, only themetallization layer M10 will be described hereinafter.

As best shown in FIG. 5A, the metallization layer M10 includes a pair offirst metal lines 520, a first metal plate 530, a pair of second metallines 540, and a second metal plate 550. The first metal lines 520 andthe second metal lines 540 are substantially parallel to each other andare arranged alternately along the length of the active region 560.

The first metal lines 520 extend from an outer periphery of the activeregion 560 into the active region 560 and toward the second edge 560 bof the active region 560. The first metal plate 530 cooperates with thefirst metal lines 520 to form a generally U-shaped cross section,interconnects sidewalls of the first metal lines 520, and extends fromthe outer periphery of the active region 560 into the active region 560,e.g., to an inner periphery of the active region 560. In this exemplaryembodiment, the first metal plate 530 is integral with the first metallines 520.

The second metal lines 540 extend from the inner periphery of the activeregion 560 toward the first edge 560 a of the active region 560. Thesecond metal plate 550 cooperates with the second metal lines 540 toform a generally U-shaped cross section, interconnects sidewalls of thesecond metal lines 540, and is disposed at the inner periphery of theactive region 560. In this exemplary embodiment, the second metal plate550 is integral with the second metal lines 540.

In this exemplary embodiment, as illustrated in FIG. 5B, the first andsecond metal lines 520, 540 and the first and second metal plates 530,550 have substantially the same thickness T. In another exemplaryembodiment, the first and second metal plates 530, 550 have a thicknessdifferent from that of the first and second metal lines 520, 540.

In this exemplary embodiment, as illustrated in FIG. 5A, the first metallines 520 have a length L1 longer than a length L2 of the second metallines 540, the first and second metal lines 520, 540 have substantiallythe same width W1, W2, and the first metal plate 530 has a length L3longer than a length L4 of the second metal plate 550. In anotherexemplary embodiment, the first and second metal lines 520, 540 havesubstantially the same length L1, L2. In another exemplary embodiment,the first metal lines 520 have a length L1 shorter than a length L2 ofthe second metal lines 540. In another exemplary embodiment, the firstmetal lines 520 have a width W1 different from a width W2 of the secondmetal lines 540. In another exemplary embodiment, the first and secondmetal plates 530, 550 have substantially the same length L3, L4. Inanother exemplary embodiment, the first metal plate 530 has a length L3shorter than a length L4 of the second metal plate 550.

FIG. 6A is a schematic sectional top view of the sixth exemplarysemiconductor device in accordance with some embodiments and FIG. 6B isa schematic sectional view taken along line 6B-6B of FIG. 6A inaccordance with some embodiments. As illustrated in FIG. 6B, thesemiconductor device includes a substrate 610 and a plurality ofmetallization layers M5-M10.

The substrate 610 has an active region 660. In an exemplary embodiment,as best shown in FIG. 6A, the active region 660 is generallyrectangular, and includes a first edge 660 a, and a second edge 660 bopposite to the first edge 660 a in a direction transverse to alongitudinal direction thereof.

The metallization layers M5-M10 are disposed sequentially from bottom totop above the substrate 610. Since the constructions of themetallization layers M5-M10 are substantially the same, only themetallization layer M10 will be described hereinafter.

As best shown in FIG. 6A, the metallization layer M10 includes a pair offirst metal lines 620, a first metal plate 630, a pair of second metallines 640, and a second metal plate 650. The first metal lines 620 andthe second metal lines 640 are substantially parallel to each other andare arranged alternately along the length of the active region 660.

The first metal lines 620 extend from an inner periphery of the activeregion 660 toward the second edge 660 b of the active region 660. Thefirst metal plate 630 cooperates with the first metal lines 620 to forma generally U-shaped cross section, interconnects sidewalls of the firstmetal lines 620, and is disposed at the inner periphery of the activeregion 660. In this exemplary embodiment, the first metal plate 630 isintegral with the first metal lines 620.

The second metal lines 640 extend from the inner periphery of the activeregion 660 toward the first edge 660 a of the active region 660. Thesecond metal plate 650 cooperates with the second metal lines 640 toform a generally U-shaped cross section, interconnects sidewalls of thesecond metal lines 640, and is disposed at the inner periphery of theactive region 660. In this exemplary embodiment, the second metal plate650 is integral with the second metal lines 640.

In this exemplary embodiment, as illustrated in FIG. 6B, the first andsecond metal lines 620, 640 and the first and second metal plates 630,650 have substantially the same thickness T. In another exemplaryembodiment, the first and second metal plates 630, 650 have a thicknessdifferent from that of the first and second metal lines 620, 640.

In this exemplary embodiment, as illustrated in FIG. 6A, the first andsecond metal lines 620, 640 have substantially the same length L1, L2and width W1, W2 and the first and second metal plates 630, 650 havesubstantially the same length L3, L4. In another exemplary embodiment,the first metal lines 620 have a length L1 different from a length L2 ofthe second metal lines 640. In another exemplary embodiment, the firstmetal lines 620 have a width W1 different from a width W2 of the secondmetal lines 640. In another exemplary embodiment, the first metal plate630 has a length L3 different from a length L4 of the second metal plate650.

FIG. 7 is a schematic sectional side view of the seventh exemplarysemiconductor device in accordance with some embodiments. As illustratedin FIG. 7 , the semiconductor device includes a substrate 710 and aplurality of metallization layers M5-M10.

The metallization layers M5-M10 are disposed sequentially from bottom totop above the substrate 710. As in the exemplary embodiments describedabove with reference to FIGS. 1A-6A and 1B-6B, each of the metallizationlayers M5-M10 of this exemplary embodiment includes a pair of firstmetal lines 720, a first metal plate 730 that interconnects the firstmetal lines 720, a pair of second metal lines 740, and a second metalplate 750 that interconnects the second metal lines 740 (only the metallines and metal plates of the metallization layer M10 are identified byreference numerals in FIG. 7 ).

In this exemplary embodiment, as illustrated in FIG. 7 , the first metalplate 730 of an overlying metallization layer, e.g., M10, of an adjacentpair of the metallization layers, e.g., M9 and M10, has a length longerthan that of the first metal plate of an underlying metallization layer,e.g., M9, of the adjacent pair of the metallization layers, e.g., M9 andM10. Also, in this exemplary embodiment, the second metal plate 750 ofan overlying metallization layer, e.g., M10, of an adjacent pair of themetallization layers, e.g., M9 and M10, has a length longer than that ofthe second metal plate of an underlying metallization layer, e.g., M9,of the adjacent pair of the metallization layers, e.g., M9 and M10.

FIG. 8 is a schematic sectional side view of the eighth exemplarysemiconductor device in accordance with some embodiments. As illustratedin FIG. 8 , the semiconductor device includes a substrate 810 and aplurality of metallization layers M5-M10.

The metallization layers M5-M10 are disposed sequentially from bottom totop above the substrate 810. As in the exemplary embodiments describedabove with reference to FIGS. 1A-6A, 1B-6B, and 7 , each of themetallization layers M5-M10 of this exemplary embodiment includes a pairof first metal lines 820, a first metal plate 830 that interconnects thefirst metal lines 820, a pair of second metal lines 840, and a secondmetal plate 850 that interconnects the second metal lines 840 (only themetal lines and metal plates of the metallization layer M10 areidentified by reference numerals in FIG. 8 ).

In this exemplary embodiment, as illustrated in FIG. 8 , the first metalplate 830 of an overlying metallization layer, e.g., M10, of an adjacentpair of the metallization layers, e.g., M9 and M10, has a length shorterthan that of the first metal plate of an underlying metallization layer,e.g., M9, of the adjacent pair of the metallization layers, e.g., M9 andM10. Also, in this exemplary embodiment, the second metal plate 850 ofan overlying metallization layer, e.g., M10, of an adjacent pair of themetallization layers, e.g., M9 and M10, has a length shorter than thatof the second metal plate of an underlying metallization layer, e.g.,M9, of the adjacent pair of the metallization layers, e.g., M9 and M10.

In the exemplary embodiments described above with reference to FIGS.1A-6A, 1B-6B, 7, and 8 , the semiconductor device further includes aplurality of diodes (not shown), a plurality of second metallizationlayers M1-M4, a plurality of third metallization layers (not shown), anda dielectric layer (not shown).

The diodes are disposed in the active region. In this exemplaryembodiment, one of the first metal line 120, 220, 320, 420, 520, 620,720, 820 and the second metal line 140, 240, 340, 440, 540, 640, 740,840 serves as anodes of the diodes, and the other of the first metalline 120, 220, 320, 420, 520, 620, 720, 820 and the second metal line140, 240, 340, 440, 540, 640, 740, 840 serves as cathodes of the diodes.In another exemplary embodiment, the semiconductor device furtherincludes transistors, another active component, capacitors, resistors,inductors, another passive component, or a combination thereof.

In the exemplary embodiments described above with reference to FIGS.1A-6A, 1B-6B, 7, and 8 , the first and second metal lines 120, 220, 320,420, 520, 620, 720, 820, 140, 240, 340, 440, 540, 640, 740, 840 and thefirst and second metal plates 130, 230, 330, 430, 530, 630, 730, 830,150, 250, 350, 450, 550, 650, 750, 850 of the metallization layersM5-M10 serve as horizontal interconnects.

The second metallization layers M1-M4 are disposed sequentially frombottom to top between the substrate 110, 210, 310, 410, 510, 610, 710,810 and the metallization layer M5. Each of the second metallizationlayers M1-M4 includes a plurality of metal lines that are parallel toeach other, that are arranged along the length of the active region 160,260, 360, 460, 560, 660, 760, 860, and that serve as horizontalinterconnects.

Each of the third metallization layers is disposed between an adjacentpair of the metallization layers M1-M10 and includes at least onevertical interconnect, i.e., via.

The dielectric layer surrounds the diodes, the metallization layersM5-M10, the second metallization layers M1-M4, and the thirdmetallization layers.

FIG. 9 is a flowchart illustrating a method 900 of fabricating asemiconductor device in accordance with some embodiments. It isunderstood that additional operations may be performed before, during,and/or after the method 900 and that some other process may only bebriefly described herein.

As illustrated in FIG. 9 , the method 900 begins with operation 910 inwhich a substrate is received. The substrate has an active region thatincludes opposite first and second edges. In some embodiments, thesubstrate is a bulk substrate. Examples of materials for the bulksubstrate include, but are not limited to, Si, Ge, another semiconductormaterial, and an alloy thereof. In some embodiments, the substrate is asemiconductor-on-insulator (SOI) substrate. The method 900 continueswith operation 920 in which a dielectric material is formed above thesubstrate. Examples of dielectric materials include, but are not limitedto, SiO, SiN, SiON, SiC, SiOC, phosphosilicate glass (PSG),borophosphosilicate glass (BPSG), and the like. The dielectric materialis formed using chemical vapor deposition (CVD), spin-on, sputtering, orother suitable deposition processes. The method 900 continues withoperation 930 in which the dielectric material is patterned, e.g., usinglithographic and etching processes, to form a plurality of holestherethrough. The method 900 continues with operation 940 in which ametal material is formed over the dielectric material and in the holesin the dielectric material. Examples of metal materials include, but arenot limited to, W, Ni, Ti, Mo, Ta, Cu, Pt, Ag, Au, Ru, Ir, Rh, Re,another metal material, an alloy of metal material and semiconductormaterial, and a combination thereof. The method 900 continues withoperation 950 in which the metal material that is on the dielectricmaterial is removed. The metal material that is in the holes in thedielectric material serves as a metallization layer, e.g., themetallization layer M10 of FIG. 1A-6A, 1B-6B, 7 , or 8.

In some embodiments, the method 900 further includes the operations of:forming a second dielectric material above the substrate; patterning thesecond dielectric material to form a plurality of holes therethrough;forming a second metal material over the second dielectric material andin the holes in the second dielectric material; and removing the secondmetal material that is on the second dielectric material. The secondmetal material that is in the holes in the second dielectric materialserves another metallization layer, e.g., the metallization layer M9 ofFIG. 1A-6A, 1B-6B, 7 , or 8.

In some embodiments, the method 900 further includes the operations of:forming a third dielectric material above the substrate; patterning thethird dielectric material to form a plurality of holes therethrough;forming a third metal material over the third dielectric layer and inthe holes in third dielectric layer; and removing the third metalmaterial that is on the third dielectric layer. The third metal materialthat is in the holes in the third dielectric material serves anothermetallization layer, e.g., the metallization layer M1 of FIG. 1A-6A,1B-6B, 7 , or 8.

Based on experimental results, when an ESD surge is applied to theconventional semiconductor device, current density of current flowingthrough the metallization layer thereof and temperatures of themetallization layer and the substrate thereof are approximately 3.9 E7A/cm², 127° C., and 77° C., respectively, whereas when an ESD surge isapplied to the semiconductor device of the present disclosure, currentdensity of current flowing through the metallization layer thereof andtemperatures of the metallization layer and the substrate thereof areapproximately 2.9 E6 A/cm², 65° C., and 62° C., respectively. Thestructures of the metallization layers of the semiconductor device ofthe present disclosure are capable of providing protection for thecomponents of the semiconductor device from ESD surges.

Those skilled in the art will readily appreciate that, after readingthis disclosure, the structure of the metallization layer described inan exemplary embodiment may be combined with that in another exemplaryembodiment. For example, in a further exemplary embodiment, thefirst/second metal plates of some of the metallization layers may havesubstantially the same length, as in the first-sixth exemplaryembodiments, while the first/second metal plates of the other of themetallization layers may have different lengths, as in the seventh andeighth exemplary embodiments. As another example, in another furtherexemplary embodiment, the first and second metal plates of some of themetallization layers may be disposed at the outer periphery of theactive region, as in the first exemplary embodiment, while the first andsecond metal plates of the other of the metallization layers may bedisposed at the inner periphery of the active region, as in the sixthexemplary embodiment.

In an exemplary embodiment of a semiconductor device, the semiconductordevice comprises a substrate and a metallization layer. The substratehas an active region that includes opposite first and second edges. Themetallization layer is disposed above the substrate, and includes a pairof metal lines that extend from an outer periphery of the active regioninto the active region and toward the second edge of the active region,and a metal plate that interconnects the metal lines, wherein at least aportion of the metal plate is disposed at the outer periphery of theactive region.

In another exemplary embodiment of a semiconductor device, thesemiconductor device comprises a substrate and a metallization layer.The substrate has an active region that includes opposite first andsecond edges. The metallization layer is disposed above the substrate,and includes a pair of metal lines that extend from an inner peripheryof the active region toward the second edge of the active region, and ametal plate that interconnects the metal lines and that is disposed atthe inner periphery of the active region.

In an exemplary embodiment of a method of fabricating a semiconductordevice, the method comprises: receiving a substrate having an activeregion that includes opposite first and second edges; forming adielectric material above the substrate; patterning the dielectricmaterial to form a plurality of holes therethrough; forming a metalmaterial over the dielectric material and in the holes in the dielectricmaterial; and removing the metal material that is on the dielectricmaterial, wherein the metal material that is in the holes includes apair of metal lines that extend toward the second edge of the activeregion, and a metal plate that interconnects the metal lines and that isdisposed at at least one of outer and inner peripheries of the activeregion.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of fabricating a semiconductor device,the method comprising: receiving a substrate having an active regionthat includes opposite first and second edges; forming a dielectricmaterial above the substrate; patterning the dielectric material to forma plurality of first holes therethrough; forming a first metal materialover the dielectric material and in the first holes in the dielectricmaterial; removing the first metal material that is on the dielectricmaterial, wherein the first metal material that is in the first holes inthe dielectric material includes a pair of first metal lines that extendtoward the second edge of the active region, and a first metal platethat horizontally interconnects the pair of first metal lines; forming asecond dielectric material above the substrate; patterning the seconddielectric material to form a plurality of second holes therethrough;forming a second metal material over the second dielectric material andin the second holes in the second dielectric material; and removing thesecond metal material that is on the second dielectric material,wherein: the second metal material that is in the second holes in thesecond dielectric material includes a pair of second metal lines thatextend toward the second edge of the active region, a second metal platethat horizontally interconnects the pair of second metal lines of thesecond metal material, and a plurality of distinct metal lines that areparallel to each other and arranged along a length of the active regionunderneath all of the first pair of metal lines and the second pair ofmetal lines, wherein: the plurality of distinct metal lines have alength that extends, on a first end, from a position underneath anintermediate portion of the first metal plate to, on a second end, aposition underneath an intermediate portion of the second metal plate,the plurality of distinct metal lines are of equal length to each other,and each distinct metal line of the plurality of distinct metal linesserves as a horizontal interconnect.
 2. The method of claim 1, whereinthe first metal plate is disposed at an outer periphery of the activeregion at a distance of about 0 μm to about 10 μm from the activeregion.
 3. The method of claim 1, wherein: the first metal plateinterconnects sidewalls of the first metal lines.
 4. The method of claim1, wherein: the first metal lines and the first metal plate havesubstantially the same thickness.
 5. The method of claim 1, wherein: thefirst metal lines and the first metal plate are integral with eachother.
 6. The method of claim 1, wherein the second metal plate isdisposed at an outer periphery of the active region.
 7. The method ofclaim 1, wherein the second metal plate is disposed at both outer andinner peripheries of the active region.
 8. The method of claim 1,wherein the second metal is disposed at an inner periphery of the activeregion.
 9. The method of claim 1, wherein an electric component isdisposed in the active region.
 10. The method of claim 9, wherein theelectric component is a diode having an anode coupled to one metal lineof the pair of first metal lines and a cathode coupled to one secondmetal line of the pair of second metal lines.
 11. A method offabricating a semiconductor device, the method comprising: forming adielectric material above a substrate having an active region in whichan electronic component is to disposed that includes opposite first andsecond edges; patterning the dielectric material to form a plurality offirst holes therethrough; forming a first metal material over thedielectric material and in the first holes in the dielectric material;and removing the first metal material that is on the dielectricmaterial, wherein the first metal material that is in the first holes inthe dielectric material includes a pair of first metal lines that extendtoward the second edge of the active region, and a first metal platethat horizontally interconnects the pair of first metal lines; andforming a plurality of distinct and equal length metal lines underneathall of the first pair of metal lines and under a subset of the firstmetal plate that are parallel to each other and arranged along a lengthof the active region such that each distinct metal line of the pluralityof distinct metal lines serves as a horizontal interconnect by: forminga second dielectric material above the substrate; patterning the seconddielectric material to form a plurality of second holes therethrough;forming a second metal material over the second dielectric material andin the second holes in the second dielectric material; and removing thesecond metal material that is on the second dielectric material;wherein: the second metal material that is in the holes in the seconddielectric material includes a pair of second metal lines that extendtoward the second edge of the active region, and a second metal platethat horizontally interconnects the pair of second metal lines of thesecond metal material; and the plurality of distinct metal lines have alength that extends, on a first end, from a position underneath anintermediate portion of the first metal plate to, on a second end, aposition underneath an intermediate portion of the second metal plate.12. The method of claim 11, wherein the first metal plate is disposed atan outer periphery of the active region at a distance of about 0 μm toabout 10 μm from the active region.
 13. The method of claim 11, wherein:the first metal plate interconnects sidewalls of the first metal lines.14. The method of claim 11, wherein: the first metal lines and the firstmetal plate have substantially the same thickness.
 15. The method ofclaim 11, wherein: the first metal lines and the first metal plate areintegral with each other.
 16. The method of claim 11, wherein the secondmetal plate is disposed at one or more of: an outer periphery or aninner periphery of the active region.
 17. The method of claim 11,wherein a diode is disposed in the active region having an anode coupledto one metal line of the pair of first metal lines and a cathode coupledto one second metal line of the pair of second metal lines.
 18. A systemcomprising: means for forming a dielectric material above a substratehaving an active region in which an electronic component is to disposedthat includes opposite first and second edges; means for patterning thedielectric material to form a plurality of holes therethrough; means forforming a first metal material over the dielectric material and in theholes in the dielectric material; means for removing the first metalmaterial that is on the dielectric material, wherein the first metalmaterial that is in the holes in the dielectric material includes a pairof first metal lines that extend toward the second edge of the activeregion, and a first metal plate that horizontally interconnects the pairof first metal lines; means for removing the second metal material thatis on the second dielectric material, wherein the second metal materialthat is in the holes in the second dielectric material includes a pairof second metal lines that extend toward the second edge of the activeregion, and a second metal plate that horizontally interconnects thepair of second metal lines of the second metal material; and means forforming a plurality of distinct and equal length metal lines underneathall of the first pair of metal lines and the second pair of metal lines,wherein the plurality of distinct and equal length metal lines have alength that extends, on a first end, from a position underneath anintermediate portion of the first metal plate to, on a second end, aposition underneath an intermediate portion of the second metal plate.